- 簡介
- CDW-500
無油超高真空電子束鍍膜機是半導體集成電路硅片鋁膜的蒸發設備,具有無油蒸氣污染、真空度高、鋁膜鈉離子污染少、膜層均勻、膜層爬越台階性能好及工作效率高等優點。
此機採用225。磁偏轉電子槍做為蒸發源,坩堝內容35cc,蒸發速率(Si-AI)
3000 ~ 4000埃 / 分。
基片夾具為球面行星轉動式。
用紅外線燈加熱機片,8分鐘基片升溫達
200。C,溫度可控。
採用寬量程真空計 (範圍 5 x 10-1
~ 4 x 10-11托) 作真空測量。
採用數字顯示石英晶體振蕩膜厚控制儀監控膜厚。
此機以 JCW-350無油超高真空鈦泵機組抽氣。主泵為400升
/ 秒三極式濺射離子泵,輔助泵為1000~1500升 /
秒鈦球升華泵,前級泵為二個1.5kg分子篩級附泵,並附有一奪機械泵加吸附阱輔助前級系統,供在缺乏液氮情況下使用。
- 主要技術性能規範
- (1) 工作室尺寸
f500 x 640mm
- (2) 極限真空度
5 x 10-9 托
- (3) 恢復真空時間
760 ~ 10-7托,1小時之內
- (4) 電子槍功率
10kW,10000V,1A 可調
- (5) 基片架自轉速度
0 ~ 36秒 / 分 可調
- (6) 基片烘烤功率
3kW 可調
- (7) 蒸發硅片量
f35 ~ f40 硅片120片
- (8) 總功率
25kW
- (9) 總耗水量
500升 / 小時
- (10) 佔地面積
2000 x 2000 x 2400mm
- (11) 總重量
2000kg
-
- Brief Introduction
- Model CWD-500 is designed for ecaporating
aluminium on siliconchips of semiconductor IC with the characteristics of no oil-steam
pollution, high vacuum, less contamination of natrium ion on the aluminous film, even
distribution of film layers, excellent step-function of the aluminous film and high
efficiency in operation.
- This model adopts a 225 magnetic-deflection
electron beam, gun as the evaporation source with the crucible capacity of 35cc and
evaporating rate of (Si-AI) 3000 ~ 4000 A/min.
- The substrate rake is of planetary movement.
- Heated by quartz halogen lamp, the
controllable substrate teperature can be raised up to 200。C in 8 minutes.
- Wide-ranging vacuum gauge (range from 5 x
10-1 to 4 x 10-11 Torr) is used for vacuum measurement.
- Film thickness is monitored by digital quartz
crystal film-thickness monitor.
- This model is pumped by JCM-350 oilless
ultra-high vacuum titanium pumping system with a triple-electrode-typed ion sputtering
pump of 400 I/sec, serving as the main pump, and a titanium sublimation pump of 1000 ~
1500 I/sec as the supplementary pump. The forestage pumps are composed of two
molecularsieve adsorptive pumps of 1.5kg and also attached a set of mechanical pumps with
adsorptive traps as forestage supplementary system, only used when nitrogen is lacked.
-
- Main Technical Specification
- (1) Vacuum Chamber:
500 x 640mm
- (2) Ultimate Vacuum:
5 x 10-9 Torr
- (3) Pumping Time:
From 760 to 10-7 Torr within an hour
- (4) Power of Electron Beam Gun:
10kW 1000V 1A (Adjustable)
- (5) Revolving Speed of Substrated Rack:
0 ~ 36 rpm (Adjustable)
- (6) Baking Power:
3 kW (Adjustable)
- (7) Numbers of Siliconchip:
35mm ~ 40mm x 120 pcs
- (8) Total Power:
25kW
- (9) Total Water Consumption:
500 I/h
- (10) Overall Dimensions:
2000 x 2000 x 2400mm
- (11) Total Weight:
Approx. 2000 kg
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